köpa 16TGV3300M18X21.5 med BYCHPS
Köp med garanti
16TGV3300M18X21.5
- Artikelnummer:
- 16TGV3300M18X21.5
- Tillverkare:
- Rubycon
- Beskrivning:
- CAP ALUM 3300UF 20% 16V SMD
- Ledningsfri status / RoHS-status:
- Blyfri / RoHS-kompatibel
- tillgänglig kvantitet:
- 15029 Pieces
Introduktion
BYCHIPS är strumpfördelaren för 16TGV3300M18X21.5, vi har lager för omedelbar frakt och även tillgänglig för lång tid leverans. Vänligen skicka oss din köpplan för 16TGV3300M18X21.5 via e-post, vi ger dig det bästa priset enligt din plan.
Specifikationer
| Spänning Betyg: | 16V |
|---|---|
| Tolerans: | ±20% |
| Surface Mount Land Size: | 0.748" L x 0.748" W (19.00mm x 19.00mm) |
| Storlek / Dimension: | 0.709" Dia (18.00mm) |
| Serier: | TGV |
| Ripple Current: | 1.08A |
| Polarisering: | Polar |
| Förpackning: | Tape & Reel (TR) |
| Förpackning / fall: | Radial, Can - SMD |
| Andra namn: | 1189-2687-2 16TGV3300M018X21.5 |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstyp: | Surface Mount |
| Fuktkänslighetsnivå (MSL): | 1 (Unlimited) |
| Tillverkarens normala ledtid: | 18 Weeks |
| Tillverkarens varunummer: | 16TGV3300M18X21.5 |
| Livstid @ Temp.: | 5000 Hrs @ 125°C |
| Spridning av bly: | - |
| Impedans: | - |
| Höjd - Sittande (Max): | 0.866" (22.00mm) |
| Utvidgad beskrivning: | 3300µF 16V Aluminum Capacitors Radial, Can - SMD 39 mOhm @ 100kHz 5000 Hrs @ 125°C |
| ESR (ekvivalent serieresistens): | 39 mOhm @ 100kHz |
| Beskrivning: | CAP ALUM 3300UF 20% 16V SMD |
| Kapacitans: | 3300µF |
| tillämpningar: | General Purpose |
| Email: | [email protected] |
Relaterade delar till 16TGV3300M18X21.5
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog