köpa MAL215976331E3 med BYCHPS
Köp med garanti
MAL215976331E3
- Artikelnummer:
- MAL215976331E3
- Tillverkare:
- Angstrohm / Vishay
- Beskrivning:
- CAP ALUM 330UF 20% 400V SNAP
- Ledningsfri status / RoHS-status:
- Blyfri / RoHS-kompatibel
- tillgänglig kvantitet:
- 19578 Pieces
Introduktion
BYCHIPS är strumpfördelaren för MAL215976331E3, vi har lager för omedelbar frakt och även tillgänglig för lång tid leverans. Vänligen skicka oss din köpplan för MAL215976331E3 via e-post, vi ger dig det bästa priset enligt din plan.
Specifikationer
| Spänning Betyg: | 400V |
|---|---|
| Tolerans: | ±20% |
| Surface Mount Land Size: | - |
| Storlek / Dimension: | 1.181" Dia (30.00mm) |
| Serier: | 159 PUL-SI |
| Ripple Current: | 1.47A @ 120Hz |
| Polarisering: | Polar |
| Förpackning: | Bulk |
| Förpackning / fall: | Radial, Can - Snap-In - 3 Lead |
| Driftstemperatur: | -25°C ~ 105°C |
| Monteringstyp: | Through Hole |
| Fuktkänslighetsnivå (MSL): | 1 (Unlimited) |
| Tillverkarens varunummer: | MAL215976331E3 |
| Livstid @ Temp.: | 5000 Hrs @ 105°C |
| Spridning av bly: | 0.394" (10.00mm) |
| Impedans: | 450 mOhm |
| Höjd - Sittande (Max): | 1.850" (47.00mm) |
| Utvidgad beskrivning: | 330µF 400V Aluminum Capacitors Radial, Can - Snap-In - 3 Lead 640 mOhm @ 100Hz 5000 Hrs @ 105°C |
| ESR (ekvivalent serieresistens): | 640 mOhm @ 100Hz |
| Beskrivning: | CAP ALUM 330UF 20% 400V SNAP |
| Kapacitans: | 330µF |
| tillämpningar: | General Purpose |
| Email: | [email protected] |
Relaterade delar till MAL215976331E3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog