köpa STGW30H60DLFB med BYCHPS
Köp med garanti
STGW30H60DLFB
- Artikelnummer:
- STGW30H60DLFB
- Tillverkare:
- ST
- Beskrivning:
- IGBT HB 600V 30A HS TO247
- Ledningsfri status / RoHS-status:
- Blyfri / RoHS-kompatibel
- tillgänglig kvantitet:
- 17312 Pieces
- Datablad:
- STGW30H60DLFB.pdf
Introduktion
BYCHIPS är strumpfördelaren för STGW30H60DLFB, vi har lager för omedelbar frakt och även tillgänglig för lång tid leverans. Vänligen skicka oss din köpplan för STGW30H60DLFB via e-post, vi ger dig det bästa priset enligt din plan.
Specifikationer
| Spänning - Samlare Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Max) @ Vge, Ic: | 2V @ 15V, 30A |
| Testvillkor: | 400V, 30A, 10 Ohm, 15V |
| Td (på / av) @ 25 ° C: | -/146ns |
| Byt energi: | 293µJ (off) |
| Leverantörs Device Package: | TO-247-3 |
| Serier: | - |
| Effekt - Max: | 260W |
| Förpackning: | Tube |
| Förpackning / fall: | TO-247-3 |
| Andra namn: | 497-15545-5 |
| Driftstemperatur: | -55°C ~ 175°C (TJ) |
| Monteringstyp: | Through Hole |
| Fuktkänslighetsnivå (MSL): | 1 (Unlimited) |
| Tillverkarens normala ledtid: | 20 Weeks |
| Tillverkarens varunummer: | STGW30H60DLFB |
| Inmatningstyp: | Standard |
| IGBT-typ: | Trench Field Stop |
| Gate Charge: | 149nC |
| Utvidgad beskrivning: | IGBT Trench Field Stop 600V 60A 260W Through Hole TO-247-3 |
| Beskrivning: | IGBT HB 600V 30A HS TO247 |
| Nuvarande - Collector Pulsed (Icm): | 120A |
| Nuvarande - Samlare (Ic) (Max): | 60A |
| Email: | [email protected] |
Relaterade delar till STGW30H60DLFB
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog