köpa FDS7082N3 med BYCHPS
Köp med garanti
FDS7082N3
- Artikelnummer:
- FDS7082N3
- Tillverkare:
- Fairchild/ON Semiconductor
- Beskrivning:
- MOSFET N-CH 30V 17.5A 8-SOIC
- Ledningsfri status / RoHS-status:
- Blyfri / RoHS-kompatibel
- tillgänglig kvantitet:
- 12624 Pieces
- Datablad:
- FDS7082N3.pdf
Introduktion
BYCHIPS är strumpfördelaren för FDS7082N3, vi har lager för omedelbar frakt och även tillgänglig för lång tid leverans. Vänligen skicka oss din köpplan för FDS7082N3 via e-post, vi ger dig det bästa priset enligt din plan.
Specifikationer
| Vgs (th) (Max) @ Id: | 3V @ 250µA |
|---|---|
| Teknologi: | MOSFET (Metal Oxide) |
| Leverantörs Device Package: | 8-SO |
| Serier: | PowerTrench® |
| Rds On (Max) @ Id, Vgs: | 6 mOhm @ 17.5A, 10V |
| Effektdissipation (Max): | 3W (Ta) |
| Förpackning: | Tape & Reel (TR) |
| Förpackning / fall: | 8-SOIC (0.154", 3.90mm Width) |
| Andra namn: | FDS7082N3_NL FDS7082N3_NLTR FDS7082N3_NLTR-ND FDS7082N3TR |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstyp: | Surface Mount |
| Fuktkänslighetsnivå (MSL): | 1 (Unlimited) |
| Tillverkarens varunummer: | FDS7082N3 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 2271pF @ 15V |
| Gate Laddning (Qg) (Max) @ Vgs: | 53nC @ 10V |
| FET-typ: | N-Channel |
| FET-funktionen: | - |
| Utvidgad beskrivning: | N-Channel 30V 17.5A (Ta) 3W (Ta) Surface Mount 8-SO |
| Avlopp till källspänning (Vdss): | 30V |
| Beskrivning: | MOSFET N-CH 30V 17.5A 8-SOIC |
| Ström - Kontinuerlig avlopp (Id) @ 25 ° C: | 17.5A (Ta) |
| Email: | [email protected] |
Relaterade delar till FDS7082N3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog